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  patented* ? 1n4942gp thru 1n4942gp vishay semiconductors formerly general semiconductor document number 88511 www.vishay.com 27-feb-02 1 glass passivated junction fast switching rectifier reverse voltage 200 to 1000v forward current 1.0a 0.107 (2.7) 0.080 (2.0) 0.034 (0.86) 0.028 (0.71) dia. 1.0 (25.4) min. 1.0 (25.4) min. 0.205 (5.2) 0.160 (4.1) dia. note: lead diameter is for suffix "e" part numbers 0.026 (0.66) 0.023 (0.58) maximum ratings & thermal characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol 1n4942gp 1N4944GP 1n4946gp 1n4947gp 1n4948gp unit * maximum repetitive peak reverse voltage v rrm 200 400 600 800 1000 v * maximum rms voltage v rms 140 280 420 560 700 v * maximum dc blocking voltage v dc 200 400 600 800 1000 v * maximum average forward rectified current 0.375" (9.5mm) lead length at t a =55 c i f(av) 1.0 a * peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 25 a typical thermal resistance (1) r ja 55 c/w * operating junction and storage temperature range t j, t stg -65 to +175 c electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. * maximum instantaneous forward voltage at 1.0a v f 1.3 v * maximum dc reverse current t a = 25 c 1.0 at rated dc blocking voltage t a =150 c i r 200 a * maximum reverse recovery time at i f =0.5a, i r =1.0a, i rr =0.25a t rr 150 250 500 ns typical junction capacitance at 4.0v, 1mhz c j 15 pf notes: (1) thermal resistance from junction to ambient, and from junction to lead at 0.375 ? (9.5mm) lead length, p.c.b. mounted *jedec registered values do-204al (do-41) features  plastic package has underwriters laboratories flammability classification 94v-0  high temperature metallurgically bonded construction  for use in high frequency rectifier circuits  fast switching for high efficiency  cavity-free glass passivated junction  capable of meeting environmental standards of mil-s-19500  1.0 ampere operation at t a =55 c with no thermal runaway  high temperature soldering guaranteed: 350 c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-204al, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.012 oz., 0.3 g dimensions in inches and (millimeters) dimensions in inches and (millimeters) * glass-plastic encapsulation technique is covered by patent no. 3,996,602, and brazed-lead assembly by patent no. 3,930,306
1n4942gp thru 1n4942gp vishay semiconductors formerly general semiconductor www.vishay.com document number 88511 2 27-feb-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) ambient temperature ( c) fig. 1 ? forward current derating curves average forward rectified current (a) fig. 3 ? typical instantaneous forward characteristics instantaneous forward voltage (v) instantaneous forward current (a) percent of rated peak reverse voltage (%) instantaneous reverse current ( a) fig. 4 ? typical reverse characteristics fig. 5 ? typical junction capacitance number of cycles at 60 h z reverse voltage (v) fig. 2 ? maximum non-repetitive peak forward surge current junction capacitance (pf) fig. 6 ? typical transient thermal impedance t, pulse duration (sec.) typical thermal impedance ( cw) peak forward surge current (a) 25 50 75 100 125 150 175 0 0.25 0.5 0.75 1.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 1 10 100 5 10 15 20 25 30 t j = t j max. 8.3ms single half sine-wave (jedec method) 0 20 40 60 80 100 0.01 0.1 1 10 20 1 10 100 1 10 30 0.01 0.1 1 10 100 0.1 1 10 100 t j = 125 c t j = 25 c 0.375" (9.5mm) lead length resistive or inductive load t j = 75 c pulse width = 300 s 1% duty cycle t j = 25 c t j = 25 c f = 1.0mh z vsig = 50mvp-p


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